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Electronics &
Circuit Materials
Semiconductor Materials
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Electronics & Circuit Materials
Toray Adhesive Sheets for Semiconductor and Electronic Components

1.Lamination of TSA to heat sink
130-180C
1m/min
0.5MPa
Easy to laminate without void
Good adhesion to various materials.(Copper,Aluminium,Polymide)


2.Press to circuit substrate
130-180C(Vacuum)press
0.5MPa
Excellent foaming properties to rough surface on circuit substrate.
Easy to control adhesive resin flow.


3.Curing process
100C,1hr+150C1to2hr

Low warpage after TSA curing.


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