TORAY logo Global Network Products Toray R&D CSR Investor Relations About Us
Product info
Electronics &
Circuit Materials
Semiconductor Materials
Where are our products used?
Inquiry
Electronics & Circuit Materials
Toray Adhesive Sheets for Semiconductor and Electronic Components

* Excellent adhesion performance to various materials such as Copper, SUS, Polyimide Film, and Glass Epoxy.
* Leading status, top share and longtime experience in the semiconductor and electronic component market.

pr



Items Unit TSA-67 TSA-51 Note
Peel strength after cure N/cm 20 20 Sample:
PI film 75u/TSA/Ni-Cu plate
5mm width,90°peel
Thermal resistance C 260 260 JEDEC LEVEL3
Glass transition temperature C 50 50 DMA
CTE ppm/C 190 170 TMA(50-150C)
Flexual modulus(Mpa) -70C
  150C
Mpa
4700
3
3600
3
DMA
 
Thermal conductivity W/mK 0.25 0.25  
Water absorption % 1.0 1.0 Weight change rate after
85C/85%RH/48hr
Volume resistivity Ωcm 3.0*1014 1.6*1015  
Dielectric constant 1MHz 4.0 4.0  
Dissipation factor 1MHz 0.08 0.08  
Processing condition - 100C1hr
+
150C
1 to 2hr
100C1hr
+
150C
1 to 2hr
 
* Environment friendly product, which can be applied to the lead free solder.

>> Go to Page Top
iЉ
 
Copyright Toray Industries, Inc. All rights reserved. Terms of Condition PrivacyPolicy Site map Move to PageTop