Toray Adhesive Tape for TAB
Toray Adhesive Sheets for Semiconductor and Electronic Components
Copper Clad Laminate Film
Cover Lay Film
Where are our products used?
Minutes order curing process became possible by new hardening system of the adhesive sheet.
By saving the curing time from hours to minutes, total cost down are possible.
Snap Curing TSA Press Condition and Adhesion
Peel Strength (N/cm)
Flexual Modulus at RT (MPa)
Ion Impurity (Na
<20, <10, <15 ppm
1. Excellent properties are attainable with the snap curing property.
2. Environment friendly product, which can be applied to the lead free solder.
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Example of TSA's process
High Adhesion Type
Longtime Heat Resistant Type
Snap Curing Type
High Thermal Conductive Type
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