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Semiconductor Materials
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Electronics & Circuit Materials
Toray Adhesive Sheets for Semiconductor and Electronic Components

Long-time heat resistance of 175C, 1000 hours, the highest in the past, was successfully developed by polymer alloy technology of thermoplastic resin and epoxy based thermosetting resin.



Long-time heat resistant type can be applied to the power device and electronic components for the automotives in which would be exposed to the high temperature for a long time.


Change of Storage Modulus After Various Time at 150C (DMA)


The new long-time heat resistant type has an outstanding storage modulus even after 150C, 1000hrs, whereas the conventional type deteriorates to crack after 150C, 500 hrs.


Items Unit TSA-16 TSA-18 Note
Peel strength after cure N/cm 12 10 Sample:
PI film 75u/TSA/Ni-Cu plate
5mm width,90°peel
Thermal resistance C 260 260 JEDEC LEVEL3
Glass transition temperature C 30,130 40,200 DMA
CTE ppm/C 100-130 100-130 TMA(50-150C)
Flexural modulus(Mpa) -70C
  150C
Mpa
3600
4
6800
32
DMA
 
Thermal conductivity W/mK 0.28 0.27  
Water absorption % 1.2 1.2 Weight change rate after
85C/85%RH/48hr
Volume resistivity Ωcm 8.0*1014 9.5*1014  
Dielectric constant 1MHz 3.7 3.8  
Dissipation factor 1MHz 0.05 0.04  
Processing condition - 100C1hr
+
170C2hr
100C1hr
+
170C2hr
 
*Environment friendly product, which can be applied to the lead free solder.
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