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Electronics &
Circuit Materials
Semiconductor Materials
Where are our products used?
Electronics & Circuit Materials
Toray COF Materials
Super Advanced CCL After Bonding simulation test
Super Advanced CCL
Super Advanced CLL is a 3 layer laminate materials which is suitable for the COF applications.
This is a fusion of adhesive technology for TAB tape and process technology for FPC.

Features of COF

<Under Development> 2 Layer Copper Laminate Materials

2 Layer Copper Laminate Materials
The 2 Layer Copper Laminate Materials with thermoplastic polyimide layer is best suited for the COF materials.
It is applicable to conventional bonding process in which require high temperature.

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