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Copper Clad Laminate Film / Cover Lay Film
squareProperties of TORAY FLEXIBLE COPPER-CLAD

Property Pre-Treatment Type F
standard type
Type K
Harogen-free type
Test Method
Peel Strength
(N/cm)
A 22.3 12.0 JIS-C6471
8.1
E-240/150 7.4 12.0
C-240/60/90 16.0 12.0
Volume Resistivity
(omegamiddotcm)
A 1x1014 1x1014 JIS-C6471
7.1
C-96/23/55 5x1013 1x1014
C-96/23/55+
C-96/40/90
1x1013  
Resistivity
(omegamiddotcm)
A 2x1013 2x1012 JIS-C6471
7.2
E-240/150+
C-24/35/55
8x1013  
C-240/60/90 5x1010 1x1010
C-240/60/90+
C-24/23/55
3x1013 2x1012
Dielectric Constant 1MHz 3.8 2.7 JIS-C6471
7.5
Dissipation Factor 1MHz 0.033 0.059
Solder Resistance
(degreeC)
E-0.5/80 320 360 JIS-C6471
C-24/60/90 260 260
Bendability
(Times)
MIT
R=0.8, 5N
MD 470(17,600) 500(200,000)*1 JIS-C6471
8.2
TD 520(19,400)  
Dimensional Charge
(%)
After etching all of
copper and heated
150degreeC/30min
MD -0.06 -0.06 JIS-C6471
9.6
TD 0.03 0.03
Chemical Resistance IPA 21.4 12.0 IPC-FC241B232
Toluene 22.3 12.0
2N-NaOH 22.3 12.0
Tg DMA 40 120  
Non-Flammability   V-0 V-0/VTM-0*2 UL94
•Rolled or High-flex electro-deposited copper foil will show about 50010 higher value. (as received)

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squareRetention of Peel Strength(%) after Chemical Exposure

  IFI-EG10
Methylethlketone 95
Dichloromethane/Trichloroethane
(50:50 weight %)
95
Toluene 100
Isopropyl alcohol 100
2N-HCl 100
2N-NaOH 100
Based on IPC-FC-241 B No.2.3.2. Immersed for 10 minutes.

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squareEftect of Humidity on Peel Strength(Kg/cm)

  IFI-EG10
Blank 2.5
C-96/40/90 2.5

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squareInsulation Resistance(omega) (under condition)

  IFI-EG10
Blank 1x1014
C-120/60/90 4x1011
C-240/60/90 1x1010

Conductor Conductor
Width:0.8mm
Spacing:1.0mm
Voltage:500V(DC)
Time:1min

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