TORAY | High-heat Resistant Polyimide Coatings Photoneece*

Electronics &
Circuit Materials

	Toray Adhesive Tape for TAB
	Toray Adhesive Sheets for Semiconductor and Electronic Components
	Copper Clad Laminate Film
	Cover Lay Film

Semiconductor Materials

	Photoneece*
	Semicofine*

Where are our products used?

	Personal Computer
	Cellular Phone

High-heat Resistant Polyimide Coatings Photoneece*

Photoneece* is an aromatic polyimide precursor solution with the following characteristics. Photoneece* is the result of Toray's extensive experience in polymerization and application technologies for polyimides and photosensitive polymers.

1.	High Crack Resistance Excellent film elongation enables high crack resistance against bending.
2.	High Electrical Insulation
3.	High Heat Resistance Low weight loss at high temperature enables high heat resistance that level is comparable to non-photosensitive polyimides.
4.	Excellent Adhesive Strength The excellent adhesive strength with various base materials can be achieved by adequate surface treatments.
5.	Fine Patterns 40m pitch (20m line and 20m space) is possible at 10m final film thickness. 30m pitch (15m line and 15m space) is possible at 3.5m final film thickness.
6.	Wide Product Line Toray offers both positive and negative working types. Positive types are aqueous soluble and environmentally friendly.