 Properties
of TORAY FLEXIBLE COPPER-CLAD |
| Property |
Pre-Treatment |
Type F
standard type |
Type K
Harogen-free type |
Test Method |
Peel
Strength
(N/cm) |
A |
22.3 |
12.0 |
JIS-C6471
8.1 |
| E-240/150 |
7.4 |
12.0 |
| C-240/60/90 |
16.0 |
12.0 |
Volume
Resistivity
(  cm) |
A |
1x1014 |
1x1014 |
JIS-C6471
7.1 |
| C-96/23/55 |
5x1013 |
1x1014 |
C-96/23/55+
C-96/40/90 |
1x1013 |
|
Resistivity
(cm) |
A |
2x1013 |
2x1012 |
JIS-C6471
7.2 |
E-240/150+
C-24/35/55 |
8x1013 |
|
| C-240/60/90 |
5x1010 |
1x1010 |
C-240/60/90+
C-24/23/55 |
3x1013 |
2x1012 |
| Dielectric Constant |
1MHz |
3.8 |
2.7 |
JIS-C6471
7.5 |
| Dissipation Factor |
1MHz |
0.033 |
0.059 |
Solder
Resistance
( C) |
E-0.5/80 |
320 |
360 |
JIS-C6471 |
| C-24/60/90 |
260 |
260 |
Bendability
(Times) |
MIT
R=0.8, 5N |
MD |
470(17,600) |
500(200,000)*1 |
JIS-C6471
8.2 |
| TD |
520(19,400) |
|
Dimensional
Charge
(%) |
After etching all of
copper and heated
150C/30min |
MD |
-0.06 |
-0.06 |
JIS-C6471
9.6 |
| TD |
0.03 |
0.03 |
| Chemical
Resistance |
IPA |
21.4 |
12.0 |
IPC-FC241B232 |
| Toluene |
22.3 |
12.0 |
| 2N-NaOH |
22.3 |
12.0 |
| Tg |
DMA |
40 |
120 |
|
| Non-Flammability |
|
V-0 |
V-0/VTM-0*2 |
UL94 |
|
| •Rolled or High-flex electro-deposited
copper foil will show about 50010 higher value. (as received) |
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|
| Retention
of Peel Strength(%) after Chemical Exposure |
| |
IFI-EG10 |
| Methylethlketone |
95 |
Dichloromethane/Trichloroethane
(50:50 weight %) |
95 |
| Toluene |
100 |
| Isopropyl alcohol |
100 |
| 2N-HCl |
100 |
| 2N-NaOH |
100 |
|
| Based on IPC-FC-241 B
No.2.3.2. Immersed for 10 minutes. |
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|
| Eftect
of Humidity on Peel Strength(Kg/cm) |
| |
IFI-EG10 |
| Blank |
2.5 |
| C-96/40/90 |
2.5 |
|
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|
Insulation
Resistance( )
(under condition) |
| |
IFI-EG10 |
| Blank |
1x1014 |
| C-120/60/90 |
4x1011 |
| C-240/60/90 |
1x1010 |
|
 |
Conductor
Width:0.8mm
Spacing:1.0mm
Voltage:500V(DC)
Time:1min |
|
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