Electronics & Circuit Materials   Toray Adhesive Tape for TAB Toray Adhesive Sheets for Semiconductor and Electronic Components Copper Clad Laminate Film Cover Lay Film Semiconductor Materials   Photoneece* Semicofine* Where are our products used?   Personal Computer Cellular Phone TORAY COPPER-CLAD LAMINATE is composed of polyimide film, heat-resistant adhesive, and copper foil. TORAY COPPER-CLAD LAMINATE is widely used as flexible printed circuits (FPCs) because of its excellent balance of thermal, mechanical, electricai and chemical properties. Series of Adhesive F: UL94 V-O approved type with good adhesion and excellent tranceparency (UL mark) K: Harogen-free type with good adhesion and excellent traceparency >> Go to Page Top Copper Foil Electro-deposited copper : 35/m, 18m, 12m, 9m Rolled copper : 35/m, 18m, 12m, 9m High-flex electro-deposited copper : 35/m, 18m, 12m, 9m >> Go to Page Top Sturcture of COPPER-CLADLAMINATE Single-Sided Double-Sided >> Go to Page Top Standard Roll Size Copper Foil Width (mm) Length (m) Paper Core Diameter (inch) Single-Sided 510,500, 250 50, 100 3 Double-Sided 510,500,250 50 6 >> Go to Page Top Series of Adhesive Copper Foil Structure Standard Roll Size Properties Retention of Peel Strength Effect of Humidity Insulation Resistance

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