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| " Toray Adhesive sheet
for Semiconductor and Electronic Components" have
excellent performance and longtime experience in the application
of the heat sink and stiffener attachment for the T-BGA
and E-BGA as well as die bonding for various advanced
packages. Toray challenges to extend the "Toray Adhesive
Sheet" to the new applications such as power device
and optical sensors by the newly developed technology. |
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Toray challenges to become a total solution provider by the wide variety line up of adhesive sheet.
| (1) |
Wide process margin. (ex. Lamination,
Punching, Cover film delamination.) |
| (2) |
Excellent reliability. (Insulation
reliability, Temperature/Humidity durability, Chemical
resistannce) |
| (3) |
Low warpage allows easy sealing on the various substrate. |
| (4) |
Environmental friendly. (Low
ion impurity content, Lead free solder applicable, Halogen
free) |
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| Item |
Standard
Specification |
Adhesive Thickness[ ] |
30,50,100 |
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Cover Film |
PET |
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Thickness of Cover Film[] |
38 |
| Width[mm] |
29.6, 39.5, 42.7 |
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*Spec can be modified depending on
the customers requirement.
Product Cross Section
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